SUBSTRATE CLEANING DEVICE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME

摘要

A substrate cleaning apparatus and the substrate processing apparatus including the same are provided to clean the end part of the circuit. The washing disposal unit(SD1) horizontally supports the substrate(W). The spin chuck(521) rotates the substrate at the circumference of the axis passing through the center of substrate. The spin chuck is fixed to the upper end of the axis of rotation(523) rotated with the chuck rotation mechanism(522). A plurality of lower nozzles(524) is installed at the neighborhood of the spin chuck to the outer side upward. The upper side nozzle(525) is diagonally installed at the upward of the spin chuck to downward. The cleansing liquid supply pipe(524a) is connected to each lower nozzle. The cleansing liquid supply pipe(525a) is connected to the upper side nozzle. The cleansing solution is supplied to the lower nozzle and upper nozzle through the cleansing liquid supply pipes.