发明名称 |
METHOD OF FABRICATING SEMICONCONDUCTOR DEVICE |
摘要 |
<p>A manufacturing method of the semiconductor device is provided to realize the double patterning technique by using the ACL hard mask as a final ILD etching mask. The second object film(33) is formed on the first object film(32). The third object film pattern(34a) exposing a part of the second object film is formed on the second object film. A plurality of first bar type patterns are separately formed on the exposed second object film. A plurality of second bar type patterns(35b) are arranged on the third object film pattern to be crossed with the plurality of first bar type patterns. A polymer pattern(35a) is formed on the lateral side of second bar type patterns. The second object film and the first object film are etched by using the polymer pattern and the third object film pattern.</p> |
申请公布号 |
KR20090011901(A) |
申请公布日期 |
2009.02.02 |
申请号 |
KR20070075940 |
申请日期 |
2007.07.27 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, DONG HYUN |
分类号 |
H01L21/027 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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