发明名称 |
METHOD OF DEPOSITING SILICON OXIDE LAYER WITH INCREASED GAP-FILL ABILITY |
摘要 |
A method for depositing a silicon oxide layer is provided to deposit a mobility improved silicon oxide layer so as to form a film for a trench uniformly, and adjust the mixture ratio of silicon sources to control mobility of the silicon oxide layer. A method for depositing a silicon oxide layer comprises the following steps. At least one silicon source and a reaction gas are supplied into a reactor. A silicon oxide layer is deposited using the supplied silicon source and the reaction gas. The silicon oxide layer includes at least one bond among Si-H, Si-Cl, and Si-F bond in Si-O bond network. The Si-H, Si-Cl, and Si-F bond are provided from the silicon source.
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申请公布号 |
KR20090011765(A) |
申请公布日期 |
2009.02.02 |
申请号 |
KR20070075682 |
申请日期 |
2007.07.27 |
申请人 |
INTEGRATED PROCESS SYSTEMS LTD. |
发明人 |
YOU, DONG HO;LEE, JUNG WOOK;LEE, KI HOON;SEO, TAE WOOK |
分类号 |
C23C16/00 |
主分类号 |
C23C16/00 |
代理机构 |
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主权项 |
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地址 |
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