发明名称 METHOD OF DEPOSITING SILICON OXIDE LAYER WITH INCREASED GAP-FILL ABILITY
摘要 A method for depositing a silicon oxide layer is provided to deposit a mobility improved silicon oxide layer so as to form a film for a trench uniformly, and adjust the mixture ratio of silicon sources to control mobility of the silicon oxide layer. A method for depositing a silicon oxide layer comprises the following steps. At least one silicon source and a reaction gas are supplied into a reactor. A silicon oxide layer is deposited using the supplied silicon source and the reaction gas. The silicon oxide layer includes at least one bond among Si-H, Si-Cl, and Si-F bond in Si-O bond network. The Si-H, Si-Cl, and Si-F bond are provided from the silicon source.
申请公布号 KR20090011765(A) 申请公布日期 2009.02.02
申请号 KR20070075682 申请日期 2007.07.27
申请人 INTEGRATED PROCESS SYSTEMS LTD. 发明人 YOU, DONG HO;LEE, JUNG WOOK;LEE, KI HOON;SEO, TAE WOOK
分类号 C23C16/00 主分类号 C23C16/00
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