| 摘要 |
A spin scrubber is provided to minimize a process defect by detecting a spray defect of chemical or pure water through the cleaning liquid nozzle. A wafer is chucked in a spin chuck. The chemical and pure water are sprayed to the surface of the chucked wafer through a plurality of cleaning solution spray nozzles(20). The position of the cleaning liquid spray nozzle is sensed by a nozzle sensor(30). A controller controls a progress state of a process by determining a position change state of the cleaning liquid spray nozzle according to a signal checked by the nozzle sensor.
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