CHUCK FOR WAFER PROBING TESTER AND WAFER PROBING TESTER WITH THE SAME

摘要

A chuck for wafer probing tester and a wafer probing tester including the same are provided to rapidly cool a chuck by forming a cooling path for minimizing thermal transmission between an air supplied in the chuck and an air ejected from the chuck. A cooling path(110) includes a first connection path and a second connection path. The first connection path(112) connects the other end(111a) of C type loop having maximum diameter among a plurality of C type loops to outside of a chuck. The second connection path(113) connects the other end(111b) of C type loop having minimum diameter among a plurality of C type loops to outside of a chuck. In a plurality of C type loops, opening part of each end is arranged into the same direction. The second connection path is positioned on the opening, and is not connected to the C type loop.