| 摘要 |
A stacked package and a manufacturing method thereof are provided to improve the electric property and reduce the thickness of the stacked package by using a carrier which is possible for the electrical contact in stead of a metal wire. The first semiconductor chip(210) is flip-chip-bonded on a substrate(200). The first carrier(220) is arranged on the first semiconductor chip. First bond fingers(222,224) are arranged on the upper side of the first carrier. The edge of the lower side of the first carrier is protruded. A plurality of second bond fingers(226) which are electrically connected with the substrate are arranged on a projection part. The second semiconductor chip(230) is flip-chip-bonded on the first carrier. The second carrier(240) having the same structure with the first carrier is electrically connected to the first carrier. |
