SEMICONDUCTOR PACKAGE AND THE MANUFACTURING METHOD THEREOF

摘要

A semiconductor package and the manufacturing method thereof is provided to reduce mechanical stress due to the thermal expansion coefficient difference between the semiconductor package and the outside board by installing thick insulating layer between the semiconductor die and redistribution layer. In a semiconductor package and the manufacturing method thereof, at least one bond pad(115) is formed in the first side of the semiconductor die(110). The first insulation layer(120) is formed on a region, in the first side of the semiconductor die, excluding bond pad and on third side of the semiconductor die. One end of the redistribution layer(130) is electrically connected to the bond pad of the semiconductor die, and the other end of the redistribution layer is extended to the surface of the first insulation layer. A second insulation layer(140) covers the redistribution layer part excluding a land and the first insulation layer part in which the redistribution layer is not formed.