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发明名称
发光二极体灯具之构造及其组装方法
摘要
本发明为关于发光二极体灯具之构造及其组装方法,透过特殊的构造及组装方法,使发光二极体灯具之组装过程更为简单,而本发明最特别之处,是先将一预设有贯孔的电路板定位于发光二极体灯具中的反射罩后端,再将发光二极体置入适当位置后予以焊固,由于其技术手段与知技术完全相反,而突破了许多制造与组装上的瓶颈,因此特别适合运用于曲度变化较大的发光二极体灯具之中,例如可运用于随车辆、交通工具之流线造型而具特殊曲度的灯组上,使具特殊曲度的灯组于组装时更为容易。
申请公布号
TW200905126
申请公布日期
2009.02.01
申请号
TW096127448
申请日期
2007.07.27
申请人
大扬电装股份有限公司
发明人
萧志祥
分类号
F21S4/00(2006.01);F21V19/06(2006.01);F21Y101/02(2006.01)
主分类号
F21S4/00(2006.01)
代理机构
代理人
黄启昌
主权项
地址
台北县土城市自强街5号5楼
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