| 摘要 |
An electroless nickel plating solution and a non-cyan based substitutional electroless gold plating solution are provided to prevent defects caused by a black pad by preventing crystal grains from forming on a plating film and forming an amorphous plating film, thereby preventing pin holes from forming in the plating film. A high phosphorous type electroless nickel plating solution comprises nickel sulfate as a nickel salt, sodium hypophosphite as a reducing agent, adipic acid, and glycine and lactic acid as a complexing agent, and comprises phosphorous in the amount of 7 to 10 wt.% based on the total weight of the plating solution. A non-cyan based substitutional electroless gold plating solution comprises a non-cyan based water soluble gold compound, sodium carbonate, and lactic acid.
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