TAPE CARRIER SUBSTRATE AND SEMICONDUCTOR DEVICE

摘要

The present invention provides a tape carrier substrate that can prevent a conductor wire on the tape carrier substrate from being broken at the boundary portion between the conductor wire and a slit formed in a folding portion of the tape carrier substrate. The slit is formed in the folding portion of the tape carrier substrate so that the width thereof located on an extensional portion side of the tape carrier substrate is larger than that located on a central portion side of the tape carrier substrate. Possible stress resulting from bending of the tape carrier substrate is thus distributed. This prevents the stress from concentrating at the boundary portion between the slit and the conductor wire.