| 摘要 |
A conductive paste that includes a binder containing a thermosetting resin and conductive particles, in which the lowest exothermic peak temperature T1 (degrees C.) among at least one exothermic peak obtained by differential scanning calorimetry of the binder and the lowest endothermic peak temperature t1 (degrees C.) among at least one endothermic peak obtained by differential scanning calorimetry of the conductive particles satisfy the relation t1-20<T1 . . . (1), thereby achieving good conductivity and excellent conductive connection reliability.
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