SEMICONDUCTOR DEVICE AND PROCESS FOR PRODUCING THE SAME

摘要

A semiconductor device having a base board; a heat conductive resin layer superimposed on the superior surface of the base board; an integrated layer including an electrode and an insulating resin layer covering all the side faces of the electrode, superimposed on the superior surface of the heat conductive resin layer; and a semiconductor element superimposed on the superior surface of the electrode, characterized in that the integrated layer is bonded via the heat conductive resin layer to the base board by thermocompression bonding. This semiconductor device excels in insulation and reliability.