| 摘要 |
PROBLEM TO BE SOLVED: To provide a tape carrier manufacturing method actualizing both manufacturing efficiency and material using efficiency higher than those in conventional multiple tape preparation. SOLUTION: The method has a first step of preparing multiple manufacturing tapes which can arrange semiconductor devices in a plurality of arrays in the cross direction, from a material tape which has a metal thin film formed on the whole surface of a material insulating tape, a second step of forming sprocket holes in the multiple manufacturing tapes, and a third step of applying metal thin film patterning to the multiple manufacturing tapes to form lead wires, applying solder resist thereto, and performing predetermined test. When the multiple manufacturing tapes are prepared from the material tape with no split or two-split in the first step, the multiple manufacturing tapes can arrange the semiconductor devices in five or more arrays in the cross direction. When the multiple manufacturing tapes are prepared from the material tape with three-split, no sprocket holes are formed tape by tape in both cross ends in a unit manufacturing tape region where the multiple manufacturing tapes are sectioned in product arrangement width units in the longitudinal direction. COPYRIGHT: (C)2009,JPO&INPIT
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