| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-frequency module having good shielding and heat radiating performance, capable of easily being constructed small and thin, and manufacturable at low cost, and to provide a manufacturing method for such high-frequency modules. SOLUTION: The high-frequency module is structured so that a circuit pattern 3 including ground pattern and electronic components 4 are arranged on the main surface of a substrate 2 and thereon a resin molding 7 and a shield layer 8 are provided, wherein the shield layer is made of an electric conductive resin and its bottom is connected with the ground pattern, so that a good shielding and a heat radiating performance are assured and the construction can be easily made small and thin. The manufacturing method uses a large-area substrate having a plurality of unit divisions, whereby a circuit is formed previously in each unit division, and cutting-off is conducted after molding of resin and a printing process of electric conductive paste, which allows manufacturing this high-frequency module at low cost. COPYRIGHT: (C)2009,JPO&INPIT
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