发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device enabling effective prevention of the etching of side wall insulating films on a gate electrode. SOLUTION: The semiconductor device comprises a semiconductor substrate 11, a gate insulating film 13 formed on the semiconductor substrate, the gate electrode 22 formed on the gate insulating film, the first insulating film 17 formed on the side face of the gate electrode, the second insulating film 28 formed of a material different from that of the first insulating film to cover the surface of the first insulating film, and the third insulating film 23 formed of a material different from that of the second insulating film to cover the semiconductor substrate, the gate electrode and the second insulating film. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009016754(A) 申请公布日期 2009.01.22
申请号 JP20070180017 申请日期 2007.07.09
申请人 TOSHIBA CORP 发明人 NOMACHI EIKO
分类号 H01L21/336;H01L21/28;H01L21/768;H01L29/78 主分类号 H01L21/336
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