| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid state imaging apparatus with small decline of sensitivity characteristics to the diaphragm (F value) characteristics of the imaging apparatus while improving the sensitivity characteristics, and its manufacturing method. SOLUTION: The solid state imaging apparatus includes an imaging region where a light receiving part 12 is arranged: a wiring layer arranged above the light receiving part 12 and provided with metal wiring 22A, 22B and 22C forming an opening and a first insulating film 20; an intra-layer lens 24 provided to each light receiving part 12 and formed on or at the upper part of the wiring layer; a transparent second insulating film formed on the wiring layer and the intra-layer lens 24; a top lens 28 which is provided to each light receiving part 12 and formed on the second insulating film 26, and whose upper surface is a convex curved surface; and a transparent film 30 formed on the top lens 28 and constituted of a material of a refractive index lower than that of the top lens 28. Thus, the focus of at least a part of incident light can be positioned above a semiconductor substrate 10. COPYRIGHT: (C)2009,JPO&INPIT
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