| 摘要 |
The semiconductor device and manufacturing method thereof are provided to prevent expansion and contraction of the common lead generated by heat. The external sharp size of the chip supporting surface(1d) of the tap(1c) is smaller than the rear side of the semiconductor chip. A plurality of leads is arranged around the tap. The semiconductor chip is mounted on the chip supporting surface of the tap. The semiconductor chip and the tap are supported by a plurality of suspending leads(1e). 4 bar leads(1f) are arranged in order to surround the tap. Bar leads are connected to the suspending lead. The semiconductor chip and lead are connected to a plurality of wires. The first slit(1g) is formed in the first connector(1j) between each suspending lead and each bar lead. |
