A METHOD FOR PROCESSING A SEMICONDUCTOR SUBSTRATE SURFACE AND A CHEMICAL PROCESSING DEVICE FOR THE SEMICONDUCTOR SUBSTRATE SURFACE

摘要

A method for processing a semiconductor substrate surface and a chemical processing device for the semiconductor substrate surface are provided. A semiconductor substrate (4) is placed above the chemical solution (5) by a holder (2). A distance exits between the lower surface of the semiconductor substrate (4) and the liquid level of the chemical solution (5). The chemical solution is sprayed onto the lower surface of the semiconductor substrate by a spray device (3), thus processing the lower surface of the semiconductor substrate. The device comprises a chemical bath (1) containing a chemical solution, a holder (2) holding the semiconductor substrate (4) above the chemical solution, and a spray device (3) spraying the chemical solution onto the lower surface of the semiconductor substrate (4). Only one surface of the semiconductor substrate (4) can be processed by this method, without protecting the other surface.