| 摘要 |
<p>The semiconductor device and the method for manufacturing the semiconductor device are provided to reduce the number of wiring board and to obtain the electrical characteristic. A plurality of electrode pads(3) is provided on the main surface(2a) of the semiconductor chip(2). A plurality of bump electrodes(5) is provided on electrode pads of the semiconductor chip. The wiring board(6) is arranged in one side of the main surface of the semiconductor chip. At this time, the wiring board is separated from the edge part of the semiconductor chip over at least, 50 mum. A plurality of external terminals(14) is provided on the wiring board. A plurality of external terminals is electrically connected to a plurality of bump electrodes through the wirings of the wiring board. The connection unit between the wiring and the bump electrode is coated with the insulating property encapsulant.</p> |
