| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thin resin-sealed semiconductor apparatus that is easy to operate. <P>SOLUTION: This easy-to-operate thin resin-sealed semiconductor apparatus is provided as follows. First, the die bonding of a semiconductor device to a lead is performed. After that, an interconnection, which electrically connects the electrode of the semiconductor device and the lead through a 3-D structure that bridges the surface of the semiconductor and the surface of the lead, is formed by heat-hardening after application or transfer, and then sealed with resin. <P>COPYRIGHT: (C)2009,JPO&INPIT |
