| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead frame structure capable of embodying a highly reliable semiconductor package at low cost. <P>SOLUTION: The lead frame structure 100 includes a first lead frame 120 having a plurality of first leads 121; a second lead frame 130 having a plurality of second leads 131; and an adhesive member 140 disposed such that the first leads 121 are made to adhere to one surface of the adhesive member; and the second leads 131 are made to adhere to the other surface of the adhesive member, wherein the first leads 121 are arranged so as not to overlap with the second leads 131. <P>COPYRIGHT: (C)2009,JPO&INPIT |
