发明名称 BONDING FILM STICKING EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To achieve miniaturization, mechanism simplification, etc. of bonding film sticking equipment. SOLUTION: This ACF sticking equipment 1 has an ACF tape supply section 12, a protective sheet feed zone 14, a heating-pressure portion 13, and a slack take-up mechanism 81. The ACF tape feed direction A1 of the ACF tape supply section 12 and the feed direction A2 of the protective sheet 61 by the protective sheet feed zone 14 are at right angles with respect to each other. The heating-pressure portion 13 heats the ACF tape 7 through the protective sheet 61 by using the tool 54 while pressurizing a sticking position 3a of a display panel 3 on the backup stage 11. The slack take-up mechanism 81 makes a load act in an orthogonal direction between a pair of side sections which face the feed direction A2 of the protective sheet 61 in the same orthogonal direction, thus removing a slack. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009016523(A) 申请公布日期 2009.01.22
申请号 JP20070176049 申请日期 2007.07.04
申请人 PANASONIC CORP 发明人 KUMAMOTO MASAHIRO;FUJIWARA KEIJI
分类号 H01L21/60 主分类号 H01L21/60
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