发明名称 LD HEAT RADIATION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide an LD heat radiation structure capable of radiating the heat of the surface part of the cylindrical metal package of a laser diode to an exterior part covering the laser diode. SOLUTION: A heat radiation member 2a is provided so as to be in contact with the cylindrical metal package 12 of the laser diode 1, and the heat of the cylindrical metal package 12 of the laser diode 1 is radiated through the heat radiation member 2a to the exterior part 3 covering the laser diode. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009016456(A) 申请公布日期 2009.01.22
申请号 JP20070174514 申请日期 2007.07.02
申请人 RICOH CO LTD 发明人 YOMOGIDA MATSUO
分类号 H01S5/022;H01L23/36 主分类号 H01S5/022
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