| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection method using a probe device capable of inspecting a probe card without heating or cooling it preliminarily, and capable of preventing surely a position shift between a probe and an inspection object to carry out highly precise inspection. SOLUTION: This inspecting method of the present invention includes a process for finding preliminarily and registering a correlation between a contact time of the probe 14A with a wafer W of prescribed high temperature or low temperature, and a stylus tip position of the probe 14A extended in response to the contact time, when inspecting the wafer W at a high temperature, and a process for estimating the stylus tip position of the probe 14A in every measurement of a chip P of the wafer W, until the probe 14A is not extended more, based on the correlation between the contact time of the probe 14A with the wafer W, and for correcting the stylus tip position of the probe 14A, based on an estimated value, to measure each chip P. COPYRIGHT: (C)2009,JPO&INPIT
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