发明名称 |
PASTE COMPOSITION AND PLASMA DISPLAY |
摘要 |
PROBLEM TO BE SOLVED: To provide a paste composition which enables the occurrence of bubbles to be suppressed and a dielectric layer excellently covering metal containing copper to be formed. SOLUTION: The paste composition contains a binder resin, a solvent containing at least one kind of monocyclic monoterpene or its hydrogenated product and an inorganic powder and is used for covering the metal containing copper. The binder resin contains an acrylic resin and a cellulose based resin. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009013354(A) |
申请公布日期 |
2009.01.22 |
申请号 |
JP20070179075 |
申请日期 |
2007.07.06 |
申请人 |
TOKYO OHKA KOGYO CO LTD |
发明人 |
INOUE TOMOYUKI;ONO TAKASHI;SHIMATANI SATOSHI;MAEDA MASATOSHI |
分类号 |
C08L33/04;C08K3/00;C08L1/00;H01J11/22;H01J11/24;H01J11/34;H01J11/38 |
主分类号 |
C08L33/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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