| 摘要 |
Embodiments relate to a semiconductor device, which adopts no wiring or contact for electric connection of a plurality of chips, achieving improved fabrication efficiency and reducing fabrication costs thereof, and a method of fabricating the same. A System In Package (SIP) semiconductor device includes a plurality of first and second semiconductor chips each having a predetermined internal circuit and being bonded opposite each other, wherein the first and second semiconductor chips include, respectively, trenches formed in the centers thereof to have a predetermined depth. First and second metal electrodes are formed in inner bottom surfaces of the respective trenches to apply current to the respective internal circuits of the first and second semiconductor chips. A liquid-phase conductive material fills in a predetermined volume of the trenches for selective conduction of the first and second metal electrodes. A plurality of bonding portions formed in surfaces of the first and second semiconductor chips to correspond to each other for coupling of the first and second semiconductor chips.
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