| 摘要 |
Provided is a surface mounting component wherein a shock applied to constitution members in manufacturing process is reduced and sufficient solder bonding strength is achieved after surface mounting. At least a part of end surfaces (5A2, 5B2) of external terminals (5A, 5B) of a surface mounting component to be bonded on a mounting substrate is a cut surface formed by cutting a member (7A), which is to be connected to the external terminals (5A, 5B) in the manufacturing process of the surface mounting component. On the external terminals (5A, 5B), a recessed section (6) is formed by being recessed from the end surfaces (5A2, 5B2). |
