发明名称 |
POLIERVORRICHTUNG UND SUBSTRATVERARBEITUNGSVERFAHREN |
摘要 |
A polishing apparatus detects the escape of a substrate from a top ring during polishing. The polishing apparatus includes a polishing table having a polishing pad, a top ring, and a substrate escape detection section for detecting escape of the substrate from the top ring. The detection section includes a light irradiation member for irradiating an area of the upper surface of the polishing pad with light, a controller for controlling the light irradiation of the light irradiation member, an image-taking member for taking an image of the area irradiated with the light, and an information processing member for processing information outputted from the image-taking member. The controller controls the light irradiation member in such a manner that it performs light irradiation at least for a period of time during which the substrate is regarded as being in contact with the polishing pad. |
申请公布号 |
DE602005011626(D1) |
申请公布日期 |
2009.01.22 |
申请号 |
DE20056011626T |
申请日期 |
2005.07.21 |
申请人 |
EBARA CORP. |
发明人 |
SAITO, KENICHIRO;YAZAWA, AKIHIRO;SASAKI, MASANORI;MITSUYA, TAKASHI |
分类号 |
B24B37/04;B24B49/12;H01L21/304 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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