| 摘要 |
PROBLEM TO BE SOLVED: To provide a chuck table mechanism for a grinder, which surely separates a wafer from a holding surface when releasing suction holding of the wafer without providing an atmospheric air releasing path to a suction path applying negative pressure to a chuck table. SOLUTION: The chuck table having the holding surface for sucking and holding a workpiece and a communication path communicated to the holding surface, is provided with: a pressure detection means 65 detecting pressure inside the communication path 613; and a control means 66 controlling a first solenoid open/close valve 633 and a second solenoid open/close valve 643, based on a detection signal from the pressure detection means 65. When releasing the suction holding of the work sucked and held on the chuck table 60, the control means 66 closes the first solenoid open/close valve 633 and intermittently opens and closes the second solenoid open/close valve 643. When the detection signal from the pressure detection means 65 reaches atmospheric pressure, the control means 66 opens the second solenoid open/close valve 643. COPYRIGHT: (C)2009,JPO&INPIT
|
