| 摘要 |
#CMT# #/CMT# The method involves cleaning a semiconductor wafer in cleaning modules and drying the wafer in a drying module. The semiconductor wafer is rinsed with water containing hydrochloric acid and separately with water in a cleaning sequence. The cleaning sequence is implemented in the same cleaning module. The cleaning sequence is executed in one of the cleaning module, which is formed as wheel cleaners and a spray cleaner. The wafer is dried immediately after the cleaning sequence in the drying module. #CMT#USE : #/CMT# Method for cleaning a semiconductor wafer in a single wafer cleaning system. #CMT#ADVANTAGE : #/CMT# The method enables reduction in the complexity in cleaning process and increment in the quality of the cleaning. |
