| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To eliminate unnecessary current conduction impedance in prior art and to efficiently and stably reduce the temperature coefficient of resistance (TCR). <P>SOLUTION: A bonding layer is applied to bond a substrate and a metallic sheet structure with a central aperture in face-to-face orientation, and then a passivation layer is applied to partially cover the exposed surface of the metallic sheet structure and to divide the surface not covered with the passivation layer in the metallic sheet structure into two electrode zones. The bonding design of the substrate and the metallic sheet structure overcomes the drawback of high cost which arises in prior art owing to the use of the semiconductor manufacturing process, and provides a simple fabrication process capable of increasing process yield and decreasing production cost. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
