| 摘要 |
PROBLEM TO BE SOLVED: To provide a holding jig and a peeling method for a thin plate body, wherein the thin plate body which is adhesively held can be peeled in a deformation-free state with simple constitution or without requiring a complicated device. SOLUTION: The holding jig 1 has a projection member 12 having atop an adhesive portion 14 where the thin plate body 5 can be adhesively held and a plate member 30 having a non-adhesive portion 32 on a surface, and the plate member 30 is disposed to move relatively to and away from the projection member 12. When the thin plate body 5 adhesively held by the holding jig 1 is peeled, the plate member 30 is moved relatively to the projection member 12 along the axis thereof and the thin plate body 5 is peeled off the adhesive portion 14 of the projection member 12. COPYRIGHT: (C)2009,JPO&INPIT |
