发明名称 Semiconductor Device Manufacturing Method and Method for Reducing Microroughness of Semiconductor Surface
摘要 Surface treatment is performed with a liquid, while shielding a semiconductor surface from light. When the method is employed for surface treatment in wet processes such as cleaning, etching and development of the semiconductor surface, increase of surface microroughness can be reduced. Thus, electrical characteristics and yield of the semiconductor device are improved.
申请公布号 US2009023231(A1) 申请公布日期 2009.01.22
申请号 US20070223385 申请日期 2007.01.30
申请人 FOUNDATION FOR ADVANCEMENT OF INTERNATIONAL SCIENCE 发明人 OHMI TADAHIRO;MORINAGA HITOSHI
分类号 H01L21/66;B08B7/00;H01L21/306 主分类号 H01L21/66
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