发明名称 |
Semiconductor Device Manufacturing Method and Method for Reducing Microroughness of Semiconductor Surface |
摘要 |
Surface treatment is performed with a liquid, while shielding a semiconductor surface from light. When the method is employed for surface treatment in wet processes such as cleaning, etching and development of the semiconductor surface, increase of surface microroughness can be reduced. Thus, electrical characteristics and yield of the semiconductor device are improved.
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申请公布号 |
US2009023231(A1) |
申请公布日期 |
2009.01.22 |
申请号 |
US20070223385 |
申请日期 |
2007.01.30 |
申请人 |
FOUNDATION FOR ADVANCEMENT OF INTERNATIONAL SCIENCE |
发明人 |
OHMI TADAHIRO;MORINAGA HITOSHI |
分类号 |
H01L21/66;B08B7/00;H01L21/306 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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