| 摘要 |
The present invention is directed to a solventborne thermosetting composition comprising: (a) a polymeric binder comprising a copolymer, said copolymer being a polymerization product of: (i) 10 to 30 percent by weight, based on the total weight of monomers used to prepare the copolymer, of a monomer having the following structure (I): wherein R1 comprises linear or branched C1 to C4 alkyl, and R2 comprises methyl, linear, cyclic or branched C1 to C20 alkyl or alkenyl; (ii) 5 to 25 percent by weight, based on the total weight of monomers used to prepare the copolymer, of a monomer having aromatic functionality; (iii) 0 to 60 percent by weight, based on the total weight of monomers used to prepare the copolymer, of an ethylenically unsaturated monomer containing secondary hydroxyl groups; and (iv) 15 to 50 percent by weight, based on the total weight of monomers used to prepare the copolymer, of an ethylenically unsaturated monomer containing primary hydroxyl groups; (b) an aminoplast curing agent; and (c) a compound comprising a capped isocyanate-functional material.
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