| 摘要 |
PROBLEM TO BE SOLVED: To provide a gas treating device capable of cooling the whole of a gas discharging mechanism to a desired temperature without using any special installation, such as ultra cold chiller, even in the large-scale gas discharging mechanism in the case of an apparatus that alternately supplies two processing gases required to keep the temperature of the gas discharging mechanism low. SOLUTION: The gas treating device comprises a gas discharging mechanism discharging a first processing gas and a second processing gas respectively supplied from first and second supplying means to the inside of a processing container, where the first processing gas and second processing gas are alternately supplied, and are reacted on a substrate to be processed, so as to form a prescribed film thereon. The gas discharging mechanism comprises: a gas discharging plate 35' having a plurality of gas discharging holes 46, 47 discharging the first and second processing gases; and coolant passages 210a to 210c, and the coolant passages 210a to 210c are provided at the gas discharging hole forming region of the gas discharging plate 35'. COPYRIGHT: (C)2009,JPO&INPIT |
