| 摘要 |
Temperature probes for measuring the temperature of objects are disclosed. The temperature probes include a housing and a tip in thermal contact with an end of the housing. The tip is adapted to contact a surface of the object whose temperature is to be measured by the temperature probe. A portion of the housing in contact with the tip has a high thermal resistance effective to thermally isolate the tip from an adjacent portion of the housing. A sensor is located inside of the housing and adapted to measure the temperature of the tip.
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