PACKAGE COMPONENT, ELECTRONIC DEVICE PROVIDED WITH THE PACKAGE COMPONENT AND PACKAGE COMPONENT MANUFACTURING METHOD

摘要

Provided are a package component, an electronic device provided with the package component and a package component manufacturing method. On a bottom surface (15) of a package main body (3), a plurality of metal bumps (4) are arranged, and on a bottom surface (15) of the package main body (3), a plurality of leads (5) are arranged to protrude outward from a side surface (16) continued from the bottom surface. The package main body (3) is provided with a wiring section (6), which electrically connects the metal bumps (4) and connecting terminals of an integrated circuit element (1) and electrically connects connecting terminals other than those electrically connected to the metal bumps (4) among the connecting terminals of the integrated circuit element (1), with a plurality of leads (5), so that the same electrical information for operating the integrated circuit element (1) is given to the integrated circuit element (1) through the metal bumps (4).