发明名称 ETCHING APPARATUS FOR SUBSTRATE
摘要 A substrate etching device for etching substrate with dimorphism is provided to perform etching process for two glass substrates. A chamber(1) is made of the first area and the second part which is adjacent to the first area. The first substrate(301) and the second substrate(302) which is in opposite directions to the first substrate are received in the border of the second part and the first area. The isolation shutter(201) is positioned in the border of the second part and the first area. The end part of the first and the second substrate is surrounded. The first area in which the first substrate is positioned and the second part in which the second substrate is positioned are cut off. The first air injection head(11) is equipped in the first area. The first etchant supply unit(111) stores the first etchant, and supplies the etchant to the first air injection head.
申请公布号 KR20090008945(A) 申请公布日期 2009.01.22
申请号 KR20070072319 申请日期 2007.07.19
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, JUNG SUB;BOK, SEUNG LYONG
分类号 G02F1/13 主分类号 G02F1/13
代理机构 代理人
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