WIRING FORMING METHOD AND WIRING FORMING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a wiring forming method and wiring forming device, which can form an irradiation spot of uniform laser beams at an arbitrary part of an application layer formed on a board and can control heat energy even on a board in which a surface shape and/or heat conductivity is not uniform.

SOLUTION: The wiring forming method includes: a step of applying a dispersion solution containing conductive grains to form an application layer 3 on the board 1 in which the surface shape and/or characteristic is not uniform; a step of continuously supplying laser beams 6 to a wiring formation region of the application layer 3 to form a conductive fine wiring 4 on the basis of board attribute information showing a shape and/or characteristic at each position of the surface of the board 1; and a step of removing materials of a region other than the conductive fine wiring 4 in the application layer 3.

COPYRIGHT: (C)2009,JPO&INPIT