发明名称 RESIN COMPOSITION, RESIN SPACER FILM, AND SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin composition excellent in shape retention function as a resin spacer and excellent also in developability, and a resin spacer film using the same. <P>SOLUTION: The resin composition is used as a resin spacer for forming a space between a substrate and a semiconductor element. The resin composition includes an alkali-soluble resin, a photopolymerizing resin, a photopolymerization initiator, and a filler in particle state. The average particle diameter of the filler is 0.05-0.35 &mu;m, and the content of the filler is 1-40 wt.%. The resin spacer film is composed of the resin composition. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009015309(A) 申请公布日期 2009.01.22
申请号 JP20080128395 申请日期 2008.05.15
申请人 SUMITOMO BAKELITE CO LTD 发明人 TAKAHASHI TOYOMASA;TAKAYAMA RIE
分类号 G03F7/004;C08J5/18;C08K3/36;C08L101/02;C08L101/12;H01L21/027 主分类号 G03F7/004
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