EMBEDDED PATTERN BOARD AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an embedded pattern board having more rigidity than an exposed pattern board having the same insulating thickness while using a carrier-insulating layer joint for satisfying a predetermined thickness required by roll transfer equipment using a conventional thick board.

SOLUTION: The embedded pattern board comprises an insulating plate, a first pattern 110 embedded and formed in one face of the insulating plate, a second pattern 120 isolated a predetermined insulating thickness from the first pattern and embedded and formed in the other face of the insulating plate, and a via 130 electrically connecting the first pattern to the second pattern.

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