| 发明名称 |
HEAT DISSIPATION PRINTED CIRCUIT BOARD, AND MANUFACTURING METHOD THEREOF |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a heat dissipation printed circuit board and a manufacturing method thereof. <P>SOLUTION: The method of manufacturing the heat dissipation printed circuit board includes (a) a step of preparing a copper clad laminate 21 having a copper foil 212 laminated on an insulating layer 211, (b) a step of using paste mainly containing carbon nanotubes to form a coating layer 22 on the surface of the copper foil, and (c) a step of removing part of the coating layer 22 and part of the copper foil 212 to form a circuit pattern 26. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
| 申请公布号 |
JP2009016795(A) |
申请公布日期 |
2009.01.22 |
| 申请号 |
JP20080095412 |
申请日期 |
2008.04.01 |
| 申请人 |
SAMSUNG ELECTRO MECH CO LTD |
发明人 |
LEE EUNG-SUEK;YANAGI SAIKO;RYU CHANG SUP;HWANG JUN-OH;MOK JEE-SOO |
| 分类号 |
H05K1/09;H05K1/02;H05K1/11;H05K3/40 |
主分类号 |
H05K1/09 |
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