| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible wiring board for a tape carrier package of which tackiness is reduced, and to provide the tape carrier package formed by using the same. SOLUTION: The flexible wiring board for the tape carrier package includes an insulating film 1, a wiring pattern 3 formed on a surface of the insulating film, and an overcoat layer 9 containing a cured resin and porous fine particles, for protecting at least part of a wiring pattern. COPYRIGHT: (C)2009,JPO&INPIT
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