发明名称 CAPACITOR MODULE WITH OPTIMIZED HEAT TRANSMISSION
摘要 The present invention relates to a capacitor module (100) having at least two capacitor cells (11-14) each having a top side (11a, 12a, 13a,.14a) and a bottom side (11b, 12b, 13b, 14b) and being arranged adjacent to each other to form a pack (10) of capacitor cells, wherein said capacitor cells each having negative (11n, 12n, 13n, 14n) and positive (11p, 12p, 13p, 14p) terminals at the top and/or bottom sides electrically connected to respective terminals of adjacent cells to form parallel and/or series connections between the individual capacitor cells, a base element (20) made of heat conductive material for supporting the pack of capacitor cells, wherein the base element being shaped for receiving the bottom sides of the capacitor pack cells, and a heat transmission element (40) provided between the pack (10) of capacitor cells (11-14) and the base element (20).
申请公布号 WO2009010235(A2) 申请公布日期 2009.01.22
申请号 WO2008EP05658 申请日期 2008.07.10
申请人 PANASONIC CORPORATION;MEINCKE, STEFFEN;BOGDAN, HOLGER;GLAPA, NORBERT 发明人 MEINCKE, STEFFEN;BOGDAN, HOLGER;GLAPA, NORBERT
分类号 H01G2/08;H01G4/38;H01G9/08 主分类号 H01G2/08
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