发明名称 |
METHOD FOR FABRICATING LIGHT-EMITTING DIODE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for fabricating a light-emitting diode which can expand a light-emitting area and has high light-emitting efficiency and heat dissipation effect. <P>SOLUTION: The method includes: a step to form a high selective layer on a semiconductor base; a step to form a light-emitting structure on the high selection-ratio layer by forming an n-type semiconductor layer on the high selective layer and forming a p-type semiconductor layer on the n-type semiconductor layer; a step to form a p-type Ohmic contact layer on the light-emitting structure; a step to form a metal layer on the p-type Ohmic contact layer; a step to remove the semiconductor base and the high selective layer; a step to form an n-type contact electrode at a position closely adjacent to the n-type semiconductor layer; and a step to form a transparent conductive layer at a position closely adjacent to the n-type semiconductor layer. <P>COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2009016367(A) |
申请公布日期 |
2009.01.22 |
申请号 |
JP20060170353 |
申请日期 |
2006.06.20 |
申请人 |
UNIT LIGHT TECHNOLOGY INC |
发明人 |
WU BOR-JEN;WU MEI-HUI;KEN KAI-FU;CHEN CHIEN-AN;CHANG YUAN-HSIAO;YEH LI-SHEI |
分类号 |
H01L33/28;H01L33/30;H01L33/34;H01L33/42 |
主分类号 |
H01L33/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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