发明名称 METHOD FOR FABRICATING LIGHT-EMITTING DIODE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for fabricating a light-emitting diode which can expand a light-emitting area and has high light-emitting efficiency and heat dissipation effect. <P>SOLUTION: The method includes: a step to form a high selective layer on a semiconductor base; a step to form a light-emitting structure on the high selection-ratio layer by forming an n-type semiconductor layer on the high selective layer and forming a p-type semiconductor layer on the n-type semiconductor layer; a step to form a p-type Ohmic contact layer on the light-emitting structure; a step to form a metal layer on the p-type Ohmic contact layer; a step to remove the semiconductor base and the high selective layer; a step to form an n-type contact electrode at a position closely adjacent to the n-type semiconductor layer; and a step to form a transparent conductive layer at a position closely adjacent to the n-type semiconductor layer. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009016367(A) 申请公布日期 2009.01.22
申请号 JP20060170353 申请日期 2006.06.20
申请人 UNIT LIGHT TECHNOLOGY INC 发明人 WU BOR-JEN;WU MEI-HUI;KEN KAI-FU;CHEN CHIEN-AN;CHANG YUAN-HSIAO;YEH LI-SHEI
分类号 H01L33/28;H01L33/30;H01L33/34;H01L33/42 主分类号 H01L33/28
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