COMPOUND SEMICONDUCTOR WAFER, METHOD OF MANUFACTURING LIGHT EMITTING ELEMENT, AND EVALUATION METHOD

摘要

PROBLEM TO BE SOLVED: To provide a compound semiconductor wafer suppressed in formation of voids and cracks to a stuck interface; to provide a method of manufacturing a light emitting element; and to provide an evaluation method.

SOLUTION: The compound semiconductor wafer includes at least a luminescent layer part, a window layer formed on a first principal surface side of the luminescent layer part, and a laminating substrate laminated on a second principal surface side of the luminescent layer part. The compound semiconductor wafer is characterized in that an irregularity treatment is applied to each peripheral part of the luminescent layer part and the window layer.

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