| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer substrate with less peeling of a polyimide film or the like in a ceramic multilayer substrate with the polyimide film laminated thereon laminated. SOLUTION: The multilayer substrate has a configuration wherein a heat resistant film is laminated on a ceramic layer, the heat resistant film is a film composed of polyimide obtained by making aromatic diamines having a benzoxazole structure react with aromatic tetracarboxylic dianhydrides, and its linear expansion coefficient is -2 to 10 ppm/°C. COPYRIGHT: (C)2009,JPO&INPIT |
