发明名称 RESIN COMPOSITION FOR COMPOUND DIELECTRIC AND COMPOUND DIELECTRIC, AND ELECTRIC CIRCUIT BOARD USING THIS DIELECTRIC
摘要 PROBLEM TO BE SOLVED: To provide a liquid composition for compound dielectric capable of obtaining a dielectric thin film having a high capacity and uniform and desired insulation property while maintaining a high dielectric constant, a dielectric, and a manufacturing method of the liquid composition for compound dielectric. SOLUTION: This is the liquid composition for compound dielectric which contains an inorganic dielectric and a fluorinated aromatic polymer, and the average particle size Dm of the inorganic dielectric in the liquid composition is 700 nm or less. Furthermore, a compound dielectric using the liquid composition for compound dielectric and an electric circuit board including the compound dielectric as a constituent portion are provided. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009016169(A) 申请公布日期 2009.01.22
申请号 JP20070176295 申请日期 2007.07.04
申请人 NIPPON SHOKUBAI CO LTD 发明人 MATSUMOTO AI;OMOTE KAZUYUKI
分类号 H01B3/00;H01G4/33;H01G4/38;H05K1/03 主分类号 H01B3/00
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