SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To cool efficiently semiconductor elements mounted in a semiconductor module. SOLUTION: A semiconductor device 100 according to the invention includes a semiconductor module 10 mounted with an IGBT element 12 and an FWD element 13 to be cooled by a cooling element 20, wherein cooling fins 30 to abut on the inner surface of the cooling element 20 are arranged in the cooling element 20 in the region where the elements 12 and 13 are mounted, and each fin 30 is composed of an outer pipe 30a and a plurality of inner pipes 30b installed inside the outer pipe 30a. This semiconductor device 100 can control the flow rate and pressure loss of a coolant flowing through the cooling element 20 and has a sufficient radiation effect. COPYRIGHT: (C)2009,JPO&INPIT