SOI SUBSTRATE, SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SOI SUBSTRATE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND DISPLAY DEVICE USING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an SOI substrate capable of easy and accurate sticking without using a separate apparatus in sticking a substrate and an SOI layer together, and to further provide a semiconductor device using the SOI substrate. SOLUTION: A recessed part is formed at a part of the upper surface of the substrate 100, and the SOI layer 105 is stuck together through a joining layer 104 to the recessed part. Since the SOI layer 105 can be stuck together matched with the recessed part provided beforehand, highly accurate sticking is easily performed without using a separate apparatus. COPYRIGHT: (C)2009,JPO&INPIT